This die per wafer calculator is used in semiconductor manufacturing and helps estimate the number of integrated circuit dies that can be produced from a single silicon wafer.
Die Per Wafer Calculator
| Wafer Diameter (mm) | Die Size (mm²) | Scribe Width (mm) | Utilization Factor | Dies per Wafer |
|---|---|---|---|---|
| 200 | 5 x 5 | 0.1 | 0.85 | 1,257 |
| 200 | 10 x 10 | 0.1 | 0.85 | 314 |
| 200 | 2 x 2 | 0.05 | 0.90 | 16,983 |
| 300 | 10 x 10 | 0.1 | 0.90 | 628 |
| 300 | 5 x 5 | 0.1 | 0.85 | 2,500 |
| 300 | 20 x 20 | 0.15 | 0.80 | 145 |
| 300 | 2 x 2 | 0.05 | 0.95 | 14,500 |
| 450 | 15 x 15 | 0.15 | 0.80 | 565 |
| 450 | 10 x 10 | 0.1 | 0.85 | 1,130 |
| 450 | 5 x 5 | 0.1 | 0.90 | 4,500 |
| 450 | 20 x 20 | 0.2 | 0.75 | 35 |
| 450 | 3 x 3 | 0.05 | 0.95 | 8,400 |
| 450 | 12 x12 | 0.1 | 0.85 | 720 |
| 600 | 25 x25 | 0.2 | 0.75 | 22 |
| 600 | 15 x15 | 0.1 | 0.80 | 576 |
| 600 | 5 x5 | 0.1 | 0.90 | 4,500 |
Die Per Wafer Formula
The formula for calculating the number of dies per wafer is:
Dies per Wafer = (π * (Wafer Diameter / 2)^2) / (Die Area + Scribe Area) * Utilization FactorWhere:
- Wafer Diameter is measured in millimeters
- Die Area is the area of a single chip in square millimeters
- Scribe Area is the area between dies used for cutting, also in square millimeters
- Utilization Factor accounts for the unusable area near the wafer’s edge
π * (Wafer Diameter / 2)^2: This calculates the total area of the circular wafer.
(Die Area + Scribe Area): Represents the total area occupied by each die, including the space needed for separation.
Utilization Factor: Typically ranges from 0.75 to 0.95, depending on the manufacturing process.
How to calculate dies per wafer?
To calculate the number of dies per wafer, follow these steps:
- Measure the wafer diameter (e.g., 300mm)
- Determine the die size (e.g., 10mm x 10mm = 100mm²)
- Account for the scribe line width (e.g., 0.1mm on each side)
- Calculate the total die area including scribe lines: (10.1mm x 10.1mm = 102.01mm²)
- Estimate the utilization factor (e.g., 0.85)
- Apply the formula:
Dies per Wafer = (π * (300 / 2)^2) / 102.01 * 0.85 ≈ 5,947 diesHow many dies are in a wafer?
- A 200mm wafer with 5mm x 5mm dies might yield around 1,500 dies
- A 300mm wafer with 2mm x 2mm dies could produce over 30,000 dies
These numbers are theoretical maximums and don’t account for defects or edge dies that may be incomplete.
How many dies in a 300mm wafer?
- Large dies (20mm x 20mm): Dies per Wafer ≈ 145
- Medium dies (10mm x 10mm): Dies per Wafer ≈ 580
- Small dies (5mm x 5mm): Dies per Wafer ≈ 2,300
- Very small dies (2mm x 2mm): Dies per Wafer ≈ 14,500
A 300mm wafer is a common size in modern semiconductor fabrication. The number of dies it can produce depends on the die size and other factors.
These calculations assume a 0.1mm scribe line and a 0.85 utilization factor.
What is the die yield per wafer?
The die yield refers to the percentage of functional dies produced from a wafer. It’s a critical metric in semiconductor manufacturing and is influenced by various factors:
- Process complexity: More complex processes tend to have lower yields
- Die size: Larger dies are more prone to defects, resulting in lower yields
- Wafer quality: Higher quality wafers generally produce better yields
- Manufacturing equipment: Advanced equipment can improve yields
To calculate die yield:
Die Yield = (Number of Functional Dies / Total Dies per Wafer) * 100%For example, if a 300mm wafer with 1,000 potential dies produces 850 functional dies:
Die Yield = (850 / 1000) * 100% = 85%This yield percentage is crucial for cost calculations and production planning.
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